Senior Substrate Layout Engineer - Phoenix, AZ

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Mercury Systems is seeking the best and brightest engineering talent to help us deliver cuttingedge technology for missioncritical aerospace and defense applications, advancing innovation where it matters most.

Job Responsibilities:

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  Provide technical leadership focused on highspeed interfaces and highdensity substrate layout techniques, guiding engineering teams to deliver highquality microelectronic solutions
  
  
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  Drive the design, layout, and analysis of complex electrical and mechanical systems, including highdensity interposers, substrates, and PCB layouts supporting digital, analog, power, and RF signals across multiple die (primarily flipchip)
  
  
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  Manage highspeed, multilayer packaging activities involving HDI structures, blind and buried vias, BGAs, RF routing, and designfortest (DFT) considerations
  
  
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  Coordinate development processes to ensure alignment with supplier Design for Manufacturing (DFM) rules and capabilities
  
  
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  Create fabrication drawings that accurately represent design intent and collaborate with fabrication suppliers to ensure successful technical transfer
  
  
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  Review artwork, drawings, and design artifacts throughout the layout cycle and during final design reviews for fabrication and assembly
  
  
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  Support multidisciplinary investigations, feasibility studies, and design trades in collaboration with crossfunctional engineering teams
  
  
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  Apply systemsthinking to understand and communicate how design decisions impact the broader system
  
  
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  Assist the team beyond specific technical discipline as needed to meet program and organizational goals
  
  

Required Qualifications:

• Bachelor's or higher degree in engineering in electrical or electronics engineering
• Typically requires a minimum of 4 years of experience as a highdensity package layout designer using industrystandard tools
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  Proficiency with Cadence APD+ physical and electrical constraint editors and experience with HDI stackups, blind/buried microvias, and finepitch routing (e.g., 15m/15m to 2m/2m or below)
  
  
• Knowledge of Cadence Constraint Manager
• Experience with 2.5D devices, interposers, substrates, flipchip, and highend package design
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  Understanding of layout techniques in digital, analog, and/or RF designs
  
  
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  Highend package design experience, especially in advanced substrate or interposer designs.
  
  
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  Ability to work within a Cadence schematic/netlistdriven layout workflow; experience with CAM tools for manufacturing data validation (CAM350 and Blueprint preferred)
  
  
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  Understanding of layout techniques for digital, analog, and RF designs; knowledge of JEDEC and IPC design, fabrication, and assembly specifications
  
  
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  Knowledge of electronic packaging techniques and collaboration with mechanical engineering teams to support 3D modeling for fit checks and thermal analyses
  
  
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  Working knowledge of JEDEC and IPC design, fabrication, and assembly specifications
  
  
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  Experience creating assembly documentation and fabrication deliverables per company and industry standards
  
  

"This position requires you to have or obtain a government security clearance. Security clearances may only be granted to U.S. citizens."

Preferred Qualifications:

• Understanding of signalintegrity fundamentals including impedance, crosstalk, and powerintegrity considerations
• Knowledge of substrate materials, stackup creation, and packaging architectures
• Experience with ThroughSilicon Via (TSV) or interposerbased designs or die stacking
• Familiarity with Ansys or Cadence simulation tools such as Sigrity and Clarity
• Ability to support electrical engineers with netlisting and componentselection tasks
• Experience routing highfrequency SERDES or RF interfaces
• Experience with scripting or automation for layout workflows

Fulltime Equivalent Job Grade Salary Range for this position
"* $75,000.00 - $150,000.00 annual salary for in-office or hybrid employees in FL, GA, IN, AZ, AL, MD or TX, and all remote employees
* $84,000.00 - $168,000.00 annual salary for in-office or hybrid employees in VA, CA, NH or MA
* $88,500.00 - $177,000.00 annual salary for in-office or hybrid employees in NJ"

Mercury Systems is a technology company that makes the world a safer, more secure place. We push processing power to the tactical edge, making the latest commercial technologies profoundly more accessible for today's most challenging aerospace and defense missions. From silicon to system scale, Mercury enables customers to accelerate innovation and turn data into decision superiority. Headquartered in Andover, Massachusetts, Mercury employs more than 2,300 people in 24 locations worldwide. To learn more, visit mrcy.com

Our Culture

We are committed to making Mercury a great place to work, no matter where our employees are located. We offer a casual and enjoyable atmosphere that allows employees to learn and grow. We help and care for one another and work as one to achieve results for us and for our customers. We value communication and transparency, and strive to foster two-way dialogue at all levels of the organization. We are committed to lifelong learning, offering comprehensive skills training and tuition reimbursement. Whether you're just starting out on your career journey or you are an experienced professional, it's important to us that you feel recognized and rewarded for your contributions.

To find out more about Why Mercury?, or visit the Mercury Community or find answers to general questions at Mercury FAQs

Mercury Systems is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex (including pregnancy), sexual orientation, gender identity, national origin, genetic information, creed, citizenship, disability, protected veteran or marital status.

As an equal opportunity employer, Mercury Systems is committed to a diverse workforce. In order to ensure reasonable accommodation for individuals protected by Section 503 of the Rehabilitation Act of 1973, the Vietnam Veterans' Readjustment Act of 1974, and Title I of the Americans with Disabilities Act of 1990, applicants that require accommodation in the job application process may contact the number below for assistance.

(978) 256-1300

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