Silicon Photonics Packaging Technical Leader

Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.

The Common Hardware Group (CHG) creates innovative hardware platforms central to the AI era, powering Cisco's core Switching, Routing, and Wireless products for organizations globally. Our innovations in silicon, optics, and hardware platforms-like Silicon One-are shaping the technology industry. We're a global team of creative experts, bringing our unique backgrounds and bold ideas to push boundaries and help each other grow. Because full product development-from design to qualification to production-is within our team, we're able to think differently, experiment more, and work quickly. Join us to power the future of the digital world.

As a Packaging Technical Leader, you will be responsible for the development and qualification of advanced packaging solutions for Cisco's next generation optical transceiver products.

• Serve as theprimary technical interfacefor the Client Optics Group with top-tier Outsourced Semiconductor Assembly & Test (OSAT) driving advanced package assembly, test, and qualification for silicon photonics products.

• Lead the design and layout of test vehicles to validate packaging processes; conduct rigorous design reviews for complex substrates, ensuring alignment with signal/power integrity requirements and manufacturing capabilities.

• Cross-functional technical leadershipto proactively identify and mitigate risks, resolve highly complex assembly issues, and establish best-in-class quality and reliability standards across the supply chain.

• Work collaboratively with other internal teams to influencepackage architecture and provide expert guidance on DfM, DfR, contributing to the definition of critical process parameters for HVM. Engage deeply in substrate design, materials selection, and reviews.

• Present technical findings and recommendations to cross-functional teams and stakeholders.

• Stay informed on emerging packaging technologies and industry trends, contributing to the evaluation of new materials, processes, and architectures.

• Masters Degree in Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or a related field with 8+ years of experience in Photonics or Semiconductor Packaging Industry or a PhD in Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or a related field with 3+ years of experience in Photonics or Semiconductor Packaging Industry

• Proven experience in advanced Silicon Photonic package technology development, such as 2.5D/3D integration, TSV, flip-chip, stacking, hybrid integration, wafer-level packaging, and package technology qualification methods

• Prior experience of package design & architecture, including substrate design and chip fabrication.

• Experience with advanced substrate manufacturing processes and materials and their impacts to device level signal and power integrity

• Experience with industry-standard design and simulation software (e.g., Cadence, klayout, Ansys or similar tools).

• Prior experience to work within and lead projects with highly cross-functional and geographically distributed technical teams.

• Experience with co-packaged optics is a plus

• Experience with volume manufacturing

• Experience with mechanical and thermal modeling and simulation software

• Experience in advanced problem-solving methodologies (e.g., 8D, FMEA, statistical process control) and data analysis skills.

At Cisco, we're revolutionizing how data and infrastructure connect and protect organizations in the AI era - and beyond. We've been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint.

Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you'll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere.

We are Cisco, and our power starts with you.

Individual pay is determined by the candidate's hiring location, market conditions, job-related skillset, experience, qualifications, education, certifications, and/or training. The full salary range for certain locations is listed below. For locations not listed below, the recruiter can share more details about compensation for the role in your location during the hiring process.

U.S. employees are offered benefits, subject to Cisco's plan eligibility rules, which include medical, dental and vision insurance, a 401(k) plan with a Cisco matching contribution, paid parental leave, short and long-term disability coverage, and basic life insurance. Please see the Cisco careers site to discover more benefits and perks. Employees may be eligible to receive grants of Cisco restricted stock units, which vest following continued employment with Cisco for defined periods of time.

U.S. employees are eligible for paid time away as described below, subject to Cisco's policies:

• 10 paid holidays per full calendar year, plus 1 floating holiday for non-exempt employees

• 1 paid day off for employee's birthday, paid year-end holiday shutdown, and 4 paid days off for personal wellness determined by Cisco

• Non-exempt employees** receive 16 days of paid vacation time per full calendar year, accrued at rate of 4.92 hours per pay period for full-time employees

• Exempt employees participate in Cisco's flexible vacation time off program, which has no defined limit on how much vacation time eligible employees may use (subject to availability and some business limitations)

• 80 hours of sick time off provided on hire date and each January 1st thereafter, and up to 80 hours ofunused sick timecarried forwardfrom one calendar yearto the next

• Additional paid time away may be requested to deal with critical or emergency issues for family members

• Optional 10 paid days per full calendar year to volunteer

For non-sales roles, employees are also eligible to earn annual bonuses subject to Cisco's policies.

Employees on sales plans earn performance-based incentive pay on top of their base salary, which is split between quota and non-quota components, subject to the applicable Cisco plan. For quota-based incentive pay, Cisco typically pays as follows:

• .75% of incentive target for each 1% of revenue attainment up to 50% of quota;

• 1.5% of incentive target for each 1% of attainment between 50% and 75%;

• 1% of incentive target for each 1% of attainment between 75% and 100%; and

• Once performance exceeds 100% attainment, incentive rates are at or above 1% for each 1% of attainment with no cap on incentive compensation.

For non-quota-based sales performance elements such as strategic sales objectives, Cisco may pay 0% up to 125% of target. Cisco sales plans do not have a minimum threshold of performance for sales incentive compensation to be paid.

The applicable full salary ranges for this position, by specific state, are listed below:

New York City Metro Area:

Non-Metro New York state & Washington state:

* For quota-based sales roles on Cisco's sales plan, the ranges provided in this posting include base pay and sales target incentive compensation combined.

** Employees in Illinois, whether exempt or non-exempt, will participate in a unique time off program to meet local requirements.