New

Silicon Photonics Packaging Engineer Co-op

NOKIA
$20.10-$70.40 USD
United States, New York, New York
171 Madison Avenue (Show on map)
Dec 12, 2025
Number of Positions: 2 Duration: 4 months Date: May 2026 - Aug 2026 Location: Onsite in Sunnyvale, CA, or New York, NY Education Recommendations Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or other similar fields with an accredited university in the USA. We are searching for a Silicon Photonics Packaging Co-op for our Summer 2026 Term to engage in the research and development of silicon photonics transceiver modules. Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers. Design optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met. Own Design Rules documents and ensure Design for Manufacturing specifications are met. Perform mechanical integrity and thermal simulations, tolerance analyses and characterization. Drive package debug activities during product validation and qualification. Plan and Drive prototype assembly builds to enable deliveries for early design validation. Apply in-depth knowledge of advanced packaging principles and stay current with new technological advancements. Experience with package and process design/development from design to production. Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs. Experience with documentation of fabrication, inspection, and assembly processes. Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively. It would be nice if you also had: Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/ 3D packages. Experience in the semiconductor chip and wafer-level back-end processing, assembly, and/or packaging. Experience in high-speed electronics package design and/or laser package design. Experience with thermo-mechanical simulations using ANSYS or similar software. Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging. Familiarity with design and simulations of optical packaging using free space optics or fiber coupling. Advancing connectivity to secure a brighter world. Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we're advancing connectivity to secure a brighter world. Learn more about life at Nokia. About the Business Group A robust digital backbone is the unsung hero of modern life, underpinning everything from daily interactions to cloud computing and critical infrastructure. The Network Infrastructure team is passionate about pushing the boundaries of what's possible in networking, tackling the toughest challenges and delivering innovative solutions. We deliver trusted, purpose-built IP, optical, fixed, and data center solutions that power the internet, drive the global economy, and support the mission-critical industries that keep the world running. Our recruitment process We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect. If you're interested in this role but don't meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity. The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.